KemLab® KL NPR 20 micron Negative Ultra Thick Packaging Photoresist

KL NPR 20 micron negative photoresist offers high sensitivity, high throughput, and excellent process latitude.

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FT = 20um; 10um, 9um 8um line/space
 
ADVANTAGES:
  • For use in i-Line, g-Line and broadband packaging applications
  • Covers 20 – 30 microns in a single coat
  • Thick straight wall photoresist designed for use with industry standard 0.26 N TMAH developers

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For more information on KemLab KL NPR negative photoresist, please contact Richard Collett at: rcollett@micromaterialstech.com