Versum Materials Photoresist Stripping Chemicals

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Product Name Description/Benefits

ACT® 114

ACT® 114 is a semi-aqueous, low-hydroxylamine content formulation designed for etch residue removal and positive resist stripping.  ACT 114 provides a lower cost of ownership and superior EHS profile compared to traditional hydroxylamine-based strippers and has the advantage of zero etch of silicon.

ACT® 273

ACT 273 is a semi-aqueous formulated product designed for effective removal of etch residues from CoWP/Cu and porous low-k technologies.

ACT® 3NR

Formulated for negative spin on and dry film thick photo resist removal processes. Environmentally-friendly chemistry with extended bath life to help customers achieve their cost-of-ownership (COO) benefits.

ACT® 410

ACT 410 is a specially formulated product for stripping hard to remove positive photoresist, including UV-cured resist and organic etch residue

ACT® 412

ACT 412 is a specially formulated product for stripping hard to remove positive photoresist, including UV-cured resist and organic etch residue.

ACT® 690SX

ACT 690SX is an organic solvent-based blend that is very effective in removing severely processed photoresist films and etch residue over corrosive sensitive metals and alloys.

ACT® 814

ACT 814 is a dilute acid chemistry specially formulated for removing refractory etch residues on Al/Cu and Cu/low k technologies.

ACT® 915A

ACT 915A is a highly effective hydroxylamine-containing etch residue remover formulated to remove etching residues after via, poly, and aluminum metal etch process.

ACT® 927C

ACT 927C is a highly effective HA-containing etch residue remover and positive photoresist stripper.  It is extremely successful in removing refractory etch residue while protecting exposed aluminum, titanium, and tungsten.

ACT® 930

ACT® 930 is a member of the reduced-Hydroxylamine family of stripper products. It is extremely effective in removing refractory etch residue and positive photoresist while protecting exposed aluminum, titanium, and tungsten.

ACT® 935 UP

ACT® 935 UP is a highly effective Hydroxylamine-containing etch residue and positive resist stripper. This product has gained acceptance in a wide range of applications throughout the semiconductor industry.

ACT® 937 UP

ACT 937 UP, a member of the Hydroxylamine family of resist stripper products, is extremely effective in removing photoresist and refractory etch.

ACT® 940

ACT 940 is a highly effective HA-containing etch residue remover and positive photoresist stripper.

ACT® 970

ACT 970, a member of the ACT family of stripper products, is extremely effective in removing refractory etch residue while protecting exposed copper.

ACT® AS-65

ACT AS-75 is a highly effective non-Hydroxylamine (HA) amine-based stripper with cleaning performance rivaling that of HA-containing products. Applications include removing refractory etch residues and photoresist on Al/Cu, Cu and low-k technologies.

ACT® AS-65

ACT AS-65 is a highly effective non-HA amine-based stripper with cleaning performance rivaling that of hydroxylamine(HA)-containing products.

ACT® AS-70

ACT AS-70 is a highly effective non-hydroxylamine (HA) amine-based stripper with cleaning performance rivaling that of HA-containing products. Applications include removing refractory etch residues and photoresist on Al/Cu, Cu and low-k technologies.

ACT® AS-80

ACT AS-80 has excellent cleaning capabilities that make this product unique. It is a highly effective non-Hydroxylamine (HA) stripper with similar cleaning performance to HA-containing strippers. ACT AS-80 can be used in aluminum applications.

ACT® CMIK-S

ACT CMIK-S is a proprietary formulation specifically designed for the effective removal of positive photoresists from highly corrosion-sensitive metals and metal alloy substrates.

ACT® CMI-S

ACT CMI-S is a corrosion inhibited water-soluble solution which effectively removes hard-processed positive resist and organic etch residue from corrosion-sensitive metal alloy substrates.

ACT® EZSTRIP® 20

ACT© EZSTRIP©20 is a highly effective non-Hydroxylamine (HA) stripper with the cleaning performance of HA-containing products. In addition, ACT EZSTRIP 20 can be used in aluminum or copper applications.

ACT® EZSTRIP® 528H

ACTEZSTRIP 528His afluoride-containing chemistry specially formulated for effective removal of post-etch and ash residue. Designed to be an aggressive cleaners mild process conditions.

ACT® NE-111

ACT® NE-111 is a buffered, pH stable fluoride-containing stripper specifically formulated for removal of highly oxidized etch residues while reducing surface metal contamination.

ACT® NE-14

ACT NE-14 is a fluoride-containing chemistry specially formulated for removal of organic and highly oxidized etch residues and/or for controlled etching of contaminated oxide surfaces, including through-silicon vias and sidewalls.

ACT® NE-168

ACT NE-168 is a buffered fluoride-containing stripper product engineered to meet the challenging requirements of semiconductor surface preparation technology.  The formulation removes ash and etch residue and is compatible with copper and low-k materials.

ACT® NE-89

ACT NE-89 is a fluoride-containing chemistry specifically formulated for use in etch residue removal and/or controlled etching of contaminated oxide surfaces, including through-silicon vias and sidewalls.

ACT® 970T New!

ACT 970T is effective in removing refractory etch residue while protecting exposed copper. It was designed specifically for use on substrates where copper corrosion is of concern.

ACT® NE-200

ACT® NE-200 is a fluoride-containing product especially formulated for removal of inorganic and highly oxidized etch residues and/or for controlled etching of contaminated oxide surfaces.

ACT® XT-1100 New!

ACT XT-1100 is a fluoride-containing chemistry formulated for removal of organic and highly oxidized etch residues on a wide range of surfaces including through-silicon vias and sidewalls.

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