Versum Materials Porous Film Thin Film Deposition

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Product Name Description/Benefits

ATRP

ATRP, a Schumacher® product, is used as a porogen source for the PECVD Thin Film Deposition of ultra low dielectric constant films.

Diethoxymethylsilane(DEMS® ILD Precursor)

Diethoxymethylsilane (DEMS® ILD Precursor), a Schumacher® product, is used as a silicon source for the chemical vapor Thin Film Deposition of high quality low dielectric constant films.

PDEMS® ILD Process

PDEMS® (Porous Diethoxymethylsilane) is a porous organosilicate glass used for ultra-low dielectric constant films.

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