KemLab KL P4800 Positive Ultra Thick Packaging Photoresist

Spin Speed Curve for KemLab KL P4800 Positive Photoresist for Packaging Applications
      KemLab-P4800-Positive-Packging-Photoresist-Spin-Speed

KL P4800 is a positive photoresist for use in i-Line, g-Line and broadband packaging applications. KL P4800 adheres to a variety of substrates; including silicon, gold, glass, aluminum, chromium and copper.

ADVANTAGES:

    • Increased Heat Resistance
    • Cover 10 – 25 microns in a single coat
    • Designed for use with industry standard KOH, TMAH, and potassium borate developers
    • No PEB necessary

 


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SDS-Kemlab-KL-P4800

Typical Process

Thickness: 10µm-25µm
Softbake: 115°C for 3.5 min (10µm) or 115°C for 4 min (15µm) or 115°C for 4 min(25µm)
Rehydration Time: 30 minutes
Expose: i-Line, Broadband or g-Line
Develop: 0.26N TMAH Developers, 0.21N KOH, Potassium borates, immersion, puddle or spray
Etch Resist: Wet Chemical Etchants (for Au, Cu, Cr, Al, etc) do not degrade
PEB: Not necessary