Dow® UV113 Positive DUV Photoresist

UV113 has been optimized to provide vertical profile imaging of isolated and semi-dense features for device production design rules to 150 nm. This resist is ideally suited for use with AR3™ anti-reflectant and a variety of inorganic substrates. UV113 offers metal etach resistance equivalent to that of conventional i-Line photoresist. Its minimal sensitivity to post-exposure bake (PEB) temperature variation (<4nm/°C), superior etch resistance, wide process window, and very low bias properties provide high-yielding device fabrication. UV113 is compatible with 0.26N developers (2.38% TMAH).