Dow® UV1100 Positive DUV Photoresist


UV1100 is a high-temperature positive DUV resist. UV1100 features excellent resolution and wide process windows for metal and trench applications. UV1100 works well for metal and trench applications. UV1100 works well on organic anti-reflectant for hard mask processes and is especially suited for metal trench applications. Advantages include:
  • Low through-pitch bias
  • Excellent etch resistance
  • Minimal SP/PEB sensitivity
  • Good process windows
  • Good resolution
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Recommended Process Conditions

 
ARL: 600Å AR3 (205°C/60 sec.)
Thickness: 3,550Å
Softbake: 130°C/60 sec.
PEB: 115°C/60 sec.
Developer: MF CD-26 (0.26N), 45 sec. Single Puddle