Dow UV135™ Positive DUV Photoresist

UV135 is an advanced gate resist for use across multiple pitches using a binary mask. Features include:
  • Low iso-dense bias
  • Maximum isolated film retention to <110nm
  • Compatible with PSM and OPC assist features to enlarge process windows

Recommended Process Conditions

Substrate: 200 mm SiON
Thickness: 4,900Å
Softbake: 120°C/60 sec. Proximity Hotplate
PEB: 115°C/60 sec. Proximity Hotplate
Developer: 0.26N, 45 sec. single spray puddle