Dow® S1800 Positive Photoresist

Spin Speed Curve for Dow S1800 Products
Dow Electronic Materials S1800 Spin Speed Chart

MICROPOSIT S1800 SERIES PHOTO RESISTS are positive photoresist systems engineered to satisfy the microelectronics industry’s requirements for advanced IC device fabrication. The system has been engineered using a toxicologically safer alternative casting solvent to the ethylene glycol derived ether acetates. Dow S1800 is a legacy product of Shipley (Rohm and Haas).
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Typical Process

Thickness: 1.1µm-4.0µm
Softbake: 115°C/60sec Contact
Expose: i-line, Broadband
PEB: N/A
Develop: MF-319 21°C 10/30sec spray/puddle