Dow® SPR220 Thick Positive Photoresist

Spin Speed Curve for Dow SPR220 Products
Dow-Electronic-Materials-SPR220-Spin-Speed

MEGAPOSIT® SPR®220 Series Photoresist SPR220 i-Line photoresist is a general purpose,multi-wavelength resist designed to cover a wide range of film thicknesses, 1–10 µm, with a single coat process. SPR220 also has excellent adhesion and plating characteristics, which make it ideal for such thick film applications as MEMs and bump processes.
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dow photoresist spr220 electron microscope image
i-Line (310 mJ/cm2)

Typical Process

 

Standard

Thickness: 1.1µm-4.0µm
Softbake: 115°C/90sec Contact
Expose: i-line, Broadband
PEB: 115°C/90sec Contact
Develop: MF-CD24A or 26A 21°C 60sec spray/puddle

Thick

Thickness: 4.0µm-10µm
Softbake: 30sec stepdown to 115°C/90sec Contact
Expose: i-line, Broadband
PEB: 115°C/90sec Contact
Develop: MF-CD24A or 26A 21°C 60sec spray/puddle