SPR3600 Series Photoresist is a positive photoresist engineered for extremely high throughput process requirements while providing excellent resolution and process latitude. Multi-wavelength capabilities make it ideal for implant and non-critical photoresist needs.
Softbake: 90°C/60sec Contact
Expose: g/i-Line, Broadband
PEB: 115°C/60sec Contact (optional)
Develop: MF-24A or 26A 21°C 60sec spray/puddle