Dow® SPR3600 Positive Photoresist

Spin Speed Curve for Dow SPR3600 Products

SPR3600 Series Photoresist is a positive photoresist engineered for extremely high throughput process requirements while providing excellent resolution and process latitude. Multi-wavelength capabilities make it ideal for implant and non-critical photoresist needs.
i-Line (310 mJ/cm2)

Typical Process



Thickness: 1.0µm-2.0µm
Softbake: 90°C/60sec Contact
Expose: g/i-Line, Broadband
PEB: 115°C/60sec Contact (optional)
Develop: MF-24A or 26A 21°C 60sec spray/puddle