Dow® SPR955-CM Positive Photoresist

Spin Speed Curve for Dow SPR955-CM Products


MEGAPOSIT® SPR955-CM Series Photoresist is a general purpose,high throughput, i-Line photoresist for 0.35 μm frontend and backend applications.
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Typical Process

 

Line/Space

Thickness: 1.0µm-2.3µm
Softbake: 100°C/90sec Proximity
Expose: i-line
PEB: 110°C/90sec Proximity
Develop: MF-CD24A or 26A 21°C 60sec spray/puddle

Contact Hole

Thickness: 0.7µm-1.2µm
Softbake: 90°C/90sec Proximity
Expose: i-line
PEB: 115°C/90sec Proximity
Develop: MF-24A or 26A 21°C 60sec spray/puddle