Dow® LOL 2000 Lift-Off Layer

Lift-off Layer Process

Submicron Lift-off enabling solution. Excellent adhesion. No mixing with photoresists. DUV flood exposure not required. Dissolution rate bake optimized for controlled undercut.
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Typical Process

Thickness: 0.7µm – 3.0µm
Softbake: 150°C – 170°C/300sec Proximity
Expose: Resist Dependent
PEB: N/A
Develop: MF-CD26(A) 21°C 30sec single puddle
Lift-off Microposit 1165 60min @ 50°C