KemLab® KL IR Lift-Off 15 Dual-Tone Photoresist

Spin Speed Curve for KemLab KL IR 15 Lift-Off Photoresist
KemLab-KL-IR-Lift-Off-Photoresist-Spin-Speed

KemLab KL IR Lift-Off 15 Photoresist is a Dual-Tone photoresist designed for i-line, g-line, and broadband exposure. It is designed for optimal lift-off process profiles when used as a negative photoresist.
PDF-Icon-Dow-Product-DataSDS-Kemlab-KL-1600
gold-deposition-SEM-kemlab-LOL
i-Line (310 mJ/cm2)

Typical Process

 

Negative Lift Off Resist Mode

Thickness: 1.2µm-2.6µm
Expose: Broadband, i-line, g-line
Reversal Bake (critical step): 130°C/90sec
Flood Exposure (non-critical): 150mJ/cm2
Develop: 0.26N TMAH
Hardbake(optional)130°C/60sec
Removal: NMP/DMSO based strippers