Dow™ MICROPOSIT™ EC Solvent 11 Edge Bead Remover


Dow™ Electronic Materials MICROPOSIT™ EC Solvent Edge Bead Remover is an Ethyl Lactate based solvent, which is used to eliminate the photoresist and anti-reflectant edge bead that occurs during typical spin coat wafer processing.

Advantages:
  • Toxicologically-safer alternative to the ethylene glycol
    derived ether acetates
  • Compatible with all MICROPOSIT™ and
    MEGAPOSIT™ Photoresists
  • Efficient and expedient removal of photoresist
    edge bead
  • Low metal-ion content
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